| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing multilayer printed circuit board capable of uniformly roughening the entire surface of a wiring circuit on an inner layer circuit board. SOLUTION: According to the manufacturing method for the multilayer printed circuit board 400, the wiring circuit 44 are formed on the main surfaces of the inner layer circuit board 40, and a prepreg 50 containing resin and fiber is overlaid on the wiring circuit 44. The inner layer circuit board 40 and cured bodies of the prepreg 50 are formed integrally into a laminated structure included in the circuit board 400. The manufacturing method includes a first roughening process of roughening the surface 44a of the wiring circuit 44 by bringing a first chemical roughening solution into contact with the surface 44a, and a second roughening process of roughening further the surface 44a after the first roughening process by bringing a second chemical roughening solution into contact with the surface 44a. COPYRIGHT: (C)2006,JPO&NCIPI |
