| 摘要 |
PROBLEM TO BE SOLVED: To provide a time savable alternative method for taking out a microscopic sample from a substrate. SOLUTION: The method for taking out the microscopic sample 1 from the substrate 2 comprises a step of performing a cutting process where the substrate 2 is irradiated with a beam 4 so as to cut out the sample from the substrate, and a step of performing an adhering process where the sample 1 is adhered to a probe 3. The cutting process and the adhering process temporarily overlap mutually. The simultaneous performing of the cutting process and adhering process can realize time saving comparing with the continuous performing of the cutting process and adhering process. COPYRIGHT: (C)2006,JPO&NCIPI
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