发明名称 |
Multi step electrodeposition process for reducing defects and minimizing film thickness |
摘要 |
The present invention relates to a method for forming a planar conductive surface on a wafer. In one aspect, the present invention uses a no-contact process with electrochemical deposition, followed by a contact process with electrochemical mechanical deposition.
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申请公布号 |
US2006011485(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20050232026 |
申请日期 |
2005.09.20 |
申请人 |
BASOL BULENT M;UZOH CYPRIAN E;TALIEH HOMAYOUN |
发明人 |
BASOL BULENT M.;UZOH CYPRIAN E.;TALIEH HOMAYOUN |
分类号 |
C25D5/10;C25D5/02;C25D5/22;C25D7/12;H01L21/288;H01L21/768 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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