发明名称 |
Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device |
摘要 |
An object of the present invention is to provide solder bumps sufficiently satisfying the expected functions and having a small diameter which conventional methods cannot attain, a semiconductor device on which these bumps are mounted, and a bump transferring sheet. The present invention provides a method for forming the bumps, which includes forming a solder alloy material layer and flux material layer one by one on an intermediate metallic layer formed on an external electrode pad in a semiconductor device, and then fusing these layers, wherein each of the solder alloy material layer and flux material layer is formed by a liquid spraying method (e.g., ink jetting method). |
申请公布号 |
US2006011703(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20050216561 |
申请日期 |
2005.08.31 |
申请人 |
ARITA HITOSHI;KOJIMA AKIO |
发明人 |
ARITA HITOSHI;KOJIMA AKIO |
分类号 |
B23K35/14;B23K35/02;B23K35/36;H01B1/22;H01L21/60;H01L23/485 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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