| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering iron by which from among a plurality of lead pins which are projected at constant spaces from sideward in a mounting component and are soldered to a board, a single lead pin is selected and separated from the board by a consecutive operation. SOLUTION: The soldering iron comprises a pair of iron points 2 which are provided in an iron point 1 for inserting into gaps on both sides of the selected lead pin 4; an inclined part 21 which is abutted on a board 6 formed at distal ends of the pair of iron points 2 at a first angleθ1; an inclined surface 22 which is cut in a tapered state so as to separate from the lead pins 4 positioned on both the sides of the pair of iron points 2; a wedge-shaped iron point 5 which is positioned between the pair of iron points 2 provided in the iron point 1, is positioned away from a distal end of the selected lead pin 4 in a state that the pair of iron points 2 are positioned near the distal end of the selected lead pin 4, and is abutted on the distal end of the selected lead pin 4 in a state that the pair of iron points 2 are advanced to a root direction of the selected lead pin 4; and an inclined surface 51 formed so as to have a larger second angleθ2 than the first angleθ1 with respect to the board 6 at a distal end of the wedge-shaped iron point 5. COPYRIGHT: (C)2006,JPO&NCIPI
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