| 摘要 |
PROBLEM TO BE SOLVED: To release heat generated from a semiconductor chip surely to a lid by preventing a variation in the thickness of thermally conductive resin between the semiconductor chip and the lid or stripping at a joint by the thermally conductive resin in a semiconductor device having a flip-chip connection structure where the semiconductor chip is covered with the lid. SOLUTION: A semiconductor chip 2 on a wiring board 1 is covered with a lid 3, thermally conductive resin 4 is interposed between recessed bottom surface 3a of the lid 3 and the semiconductor chip 2, an adhesive 5 is interposed between recessed top surface 3b of the lid 3 and the wiring board 1, and then they are pressed to harden the adhesive 5 in such a state that the interval between the recessed bottom face 3a and the semiconductor chip 2 is made uniform. After they are released, the thermally conductive resin 4 and the adhesive 5 are fully hardened, thus manufacturing a semiconductor device. COPYRIGHT: (C)2006,JPO&NCIPI
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