Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool

摘要

The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad ( 4 ), a drive unit ( 9 ), pressing means ( 6 ), a wafer holder ( 5 ), first dispensing means ( 7 ) and second dispensing means ( 8 ); the wafer holder for holding a wafer (W) being arranged at a holder location (L 0 ); the pressing means ( 6 ) being arranged to press the wafer holder ( 5 ) to the polishing pad ( 4 ); the first dispensing means ( 7 ) for dispensing a first fluid on the polishing pad ( 4 ) being arranged at a first dispensing means location (L 1 ); the second dispensing means ( 8 ) for dispensing a second fluid on the polishing pad ( 4 ) being arranged at a second dispensing means location (L 2 ); the polishing pad ( 4 ) comprising a polishing surface for polishing the wafer (W), and the polishing pad ( 4 ) further being connected to the drive unit ( 9 ) for moving the polishing surface in a first direction (omega₁) relative to the holder location (L 0 ); wherein the first dispensing means location (L 1 ) of the first dispensing means ( 7 ) is arranged in a downstream direction with respect to the holder location (L 0 ) at a first downstream distance (d 1 ), with the downstream direction being taken in relation to the first direction (omega₁); and the second dispensing means location (L 2 ) of the second dispensing means ( 8 ) is arranged in an upstream direction with respect to the holder location (L 0 ) at a first upstream distance (d 3 ), with the upstream direction being taken in relation to the first direction (omega₁). The invention further relates to a method of chemical-mechanical polishing using such an arrangement.