| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation curable resin composition for adhesive having excellent wet-heat resistance and liquid storage stability under a fluorescent lamp compared with conventional composition and provide an adhesive for optical disk containing the composition. <P>SOLUTION: The radiation curable resin composition for adhesive use contains (A) 25-65 wt.% trifunctional (meth)acrylate, (B) 25-60 wt.% bisphenol-type epoxy (meth)acrylate having hydroxy group, (C) 1-45 wt.% di(meth)acrylate having a structural unit expressed by the general formula; CH<SB>2</SB>C(CH<SB>3</SB>)HO and other than the component B and (D) 0.01-15 wt.% photopolymerization initiator. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
