发明名称 METHOD FOR TAKING OUT MICROSCOPIC SAMPLE FROM SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a time savable alternative method for taking out a microscopic sample from a substrate. SOLUTION: The method for taking out the microscopic sample 1 from the substrate 2 comprises a step of performing a cutting process where the substrate 2 is irradiated with a beam 4 so as to cut out the sample 1 from the substrate 2, and a step of performing an adhering process where the sample 1 is adhered to a probe 3. In at least a partial period of the duration of the cutting process, the cutting process is simultaneously by at least two beams 4 and 5. The cutting by at least two beams allows extraction of the sample 1 without changing the azimuth of the substrate 2 related to a beam generating means. The possibility of simultaneously operating two beams and keeping constant azimuth provides time saving comparing with a method of performing the cutting with a single beam. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006017729(A) 申请公布日期 2006.01.19
申请号 JP20050192744 申请日期 2005.06.30
申请人 FEI CO 发明人 GEZINUS TAPPEL HENK
分类号 G01N1/32;G01N1/28 主分类号 G01N1/32
代理机构 代理人
主权项
地址