发明名称 |
Film bulk acoustic resonator package and method of fabricating same |
摘要 |
A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection connects the circuit and the FBAR device.
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申请公布号 |
US2006012021(A1) |
申请公布日期 |
2006.01.19 |
申请号 |
US20040890343 |
申请日期 |
2004.07.13 |
申请人 |
LARSON JOHN D III;BAI QING;MATTA FARID;VERHOEVEN TRACY |
发明人 |
LARSON, JOHN D.III;BAI QING;MATTA FARID;VERHOEVEN TRACY |
分类号 |
H01L21/48;H01L23/52 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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