Method of producing electrical contacts through a composite sheet of semiconductor chips and plastic having conductive particles applies high voltage across sheet

摘要

A method of producing electrical through contacts (1) comprises forming a composite plate (2) having an upper semiconductor chip layer (3) with active surfaces and a lower layer of insulating plastic (4) filled with conductive particles (9). High voltage is applied through the sheet between point electrodes to form the contacts. An independent claim is also included for a semiconductor module produced as above.