METHOD AND DEVICE FOR THE ALTERNATE CONTACTING OF TWO WAFERS

摘要

The invention relates to a device for the alternate contacting of two wafer-like component/composite arrangements of a number of connected similar components, in particular of a semiconductor wafer (12) with a functional component wafer (14), for the generation of electronic modules on wafer planes, whereby the component/composite arrangements are each arranged on a mounting device (11; 13) and the contact pressure necessary for contact between contact metallisations for contacting on the component/composite arrangements is generated by a vacuum in a contact chamber, defined by the mounting devices, housing the component/composite arrangements and the contacting of the contact metallisations is achieved by a back energising of a component/composite arrangement.