| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling device of a semiconductor device arranged to suppress temperature rise surely by absorbing heat generated from a semiconductor chip effectively. <P>SOLUTION: A recess 40 is formed by etching a planar metallic material 38 having a thickness of several tens μm, a cooling block 11 having a circulation passage 42 being formed by internally matching the recess 40 is fixed to overlap a semiconductor chip 10 or in proximity thereto by bonding the planar metallic material 38, and forced cooling is carried out by circulating cooling water or refrigerant through the circulation passage 42. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
