| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent delamination, cracking or the like in a film within a semiconductor chip by suppressing a stress applied to the semiconductor chip mounted on a semiconductor apparatus. <P>SOLUTION: The semiconductor apparatus comprises a semiconductor chip, an electrode formed on a main surface of the semiconductor chip, and a wiring board having the semiconductor chip mounted thereon. In the semiconductor apparatus, rewiring is provided for electrically connecting the wiring of the wiring board with the electrode as an example. The rewiring is used so as to relax a stress generated between the chip and the wiring board. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
