| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card equipped with a substrate, an external terminal arranged at one side of the substrate and an IC module arranged on the opposite side face of the external terminal of the substrate, and equipped with an IC chip for performing contact type data communication through the external terminal with an external data reading device, and to provide an IC card for improving the strength of a card substrate and the IC module by improving the shape of the bottom face of the IC module in a manufacturing process, the recess shape of the spot facing of the card substrate and the bonding method of the interface, and for preventing the occurrence of any failure by preventing such breakdown as the invalidity of the use of the IC chip when a physical load is imposed due to the external force of the IC card. <P>SOLUTION: An IC module is buried in the recess of a card substrate so that an IC chip can be arranged inside and an external terminal can be arranged on a card external surface, wherein an elastic sheet is arranged between at least the IC chip of the recess and the card substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
