发明名称 Heat sink and retaining clip assembly
摘要 Apparatus and methods for secure attachment of a heat sink to its respective retention clip as well as attachment to an electronic device are presented. One embodiment of a retention clip retention apparatus consists of a protruding hip depending from a side of a heat sink protrusion adapted to capture the retention clip between the hip and the heat sink body. One embodiment of a method for forming the hip consists of using a tool to deform the heat sink protrusion. One embodiment of heat sink lateral retention apparatus consists of one or more split bobbins adapted to attach to the retention clip to prevent lateral motion of the heat sink with respect to the clip.
申请公布号 US2006012960(A1) 申请公布日期 2006.01.19
申请号 US20050230875 申请日期 2005.09.20
申请人 INTEL CORPORATION 发明人 HSIEH GEORGE;ANDERSON GEORGE R.;FLOYDE CHERYL M.
分类号 H05K7/20;H01L23/40 主分类号 H05K7/20
代理机构 代理人
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