发明名称 Semiconductor devices having a planarized insulating layer and methods of forming the same
摘要 A semiconductor device includes at least one phase-change pattern disposed on a semiconductor substrate. A planarized capping layer, a planarized protecting layer, and a planarized insulating layer are sequentially stacked to surround sidewalls of the at least one phase-change pattern. An interconnection layer pattern is disposed on the planarized capping layer, the planarized protecting layer, and the planarized insulating layer. The interconnection layer pattern is in contact with the phase-change pattern.
申请公布号 US2006011959(A1) 申请公布日期 2006.01.19
申请号 US20050184701 申请日期 2005.07.19
申请人 PARK JAE-HYUN;OH JAE-HEE;JEONG WON-CHEOL 发明人 PARK JAE-HYUN;OH JAE-HEE;JEONG WON-CHEOL
分类号 H01L29/94;H01L21/461;H01L21/4763 主分类号 H01L29/94
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