IMPROVING WATER-BARRIER PERFORMANCE OF AN ENCAPSULATING FILM

摘要

A method and apparatus for depositing a material layer onto a substrate at low temperature is described. The material layer can be used as an encapsulating layer for low temperature processes required in various display applications due to thermal instability of underlying materials. The encapsulating layer includes one or more material layers (multilayer) having one or more barrier layer materials and one or more low-dielectric constant materials to reduce surface roughness, improve water-barrier performance, reduce thermal stress, and provide good step coverage for many substrate types and many substrate sizes. Accordingly, the encapsulating layer thus deposited provides good device lifetime for various display devices, such as OLED devices. In addition, a method of depositing an amorphous carbon material on a substrate at low temperature is provided. The amorphous carbon material can be used to reduce thermal stress and prevent the deposited thin film from peeling off the substrate.