发明名称 |
DEVICE EVALUATION ELEMENT, TEG, SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE EVALUATION METHOD, AND SEMICONDUCTOR DEVICE FABRICATION PROCESS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device evaluation element realizing process evaluation in the way of fabrication process in a short time even in case of a micro semiconductor device. <P>SOLUTION: The device evaluation element is provided with an alignment mark for performing alignment by means of an electron beam or light, and a semiconductor device evaluation element having an electron beam receiving region is arranged at a position separated by a predetermined distance from the alignment mark. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006019562(A) |
申请公布日期 |
2006.01.19 |
申请号 |
JP20040196662 |
申请日期 |
2004.07.02 |
申请人 |
FAB SOLUTION KK |
发明人 |
YAMADA KEIZO |
分类号 |
H01L21/66;H01L21/02;H01L21/027 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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