发明名称 DEVICE EVALUATION ELEMENT, TEG, SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE EVALUATION METHOD, AND SEMICONDUCTOR DEVICE FABRICATION PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a device evaluation element realizing process evaluation in the way of fabrication process in a short time even in case of a micro semiconductor device. <P>SOLUTION: The device evaluation element is provided with an alignment mark for performing alignment by means of an electron beam or light, and a semiconductor device evaluation element having an electron beam receiving region is arranged at a position separated by a predetermined distance from the alignment mark. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006019562(A) 申请公布日期 2006.01.19
申请号 JP20040196662 申请日期 2004.07.02
申请人 FAB SOLUTION KK 发明人 YAMADA KEIZO
分类号 H01L21/66;H01L21/02;H01L21/027 主分类号 H01L21/66
代理机构 代理人
主权项
地址