| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance a circuit board technology, thus providing a manufacturing method for a circuit board that can be achieved comparatively easily and at low cost, by using the steps for a publicly known technology. <P>SOLUTION: A circuit substrate is disclosed that includes multiple continuously formed apertures that form mutually facing edge parts in a conductive layer so as to insulate the divided parts of the conductive layer, such that the conductive layer, is used for a different function (e.g., both as a power supply and a ground) in a product (e.g., an electrical assembly) that includes the substrate as a part of it. Further, the manufacturing methods for the substrate, an electrical assembly using the substrate, a multilayered circuit assembly that has used the substrate, and an information processing system (e.g., a main-frame computer) are disclosed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
