| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metallic layer for a printed circuit board in which Ni plating is applied to copper alloy foil having a smooth surface and also having heat resistance. <P>SOLUTION: The material for a printed circuit board is characterized in that at least one side of rolled copper alloy foil which is not softened even if being heated at 300°C for 1 hr is finished so as to be a glossy face, and Ni or Ni alloy plating of≥0.3μm is applied to the face. It is preferable that, as the heat resistant copper alloy foil, Sn-containing copper foil, or Cr and Zr-containing copper foil is used, the Ni plating finished to the glossy face has a surface satisfying a 60 degree specular glossiness of≥40%, and as the Ni plating, glossy Ni plating is used. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
