| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor substrate adsorption hand and its operation method for surely adsorbing a semiconductor substrate even when the semiconductor substrate is largely scaled and made thin, and the surface is bent, and for easily setting the semiconductor substrate on an adsorption stage for treating it, and for extremely reducing the surface contamination of the semiconductor substrate. SOLUTION: This semiconductor substrate adsorption hand is provided with a chuck 10 supported by an arm 1 for holding a semiconductor substrate 15, and a substrate adsorber 11 arranged at the central part of the chuck for carrying out the vacuum adsorption of the semiconductor substrate and a plurality of pins 8 arranged at the periphery of the chuck for suppressing the periphery of the semiconductor substrate. A plurality of projections whose top end diameters are smaller than those of other parts are planted in the substrate adsorber, and configured so that those top ends can be brought into contact with the semiconductor substrate when the semiconductor substrate is adsorbed. Thus, the semiconductor substrate can be adsorbed while being corrected to a plane shape by using the hand. COPYRIGHT: (C)2006,JPO&NCIPI |
