| 摘要 |
PROBLEM TO BE SOLVED: To reduce poor plating such as cracking or burning that occurs during the conventional partial spray plating, and improve current density significantly. SOLUTION: The partial plating apparatus uses a pressure reduction system among a tank 12, a mask 5 and a sparger 2. The mask 5 is fitted onto the plating area of a material 6, and pressure is applied thereon from the upper side by a cylinder shaft 1 to seal the plating surface. Chemicals are pooled in the tank 12, and when a valve 9 is opened, the sparger 2 is filled with them, and then a transfer pump 10 is operated to suck the chemicals through a pipe 4 for positive electrode. The chemicals are sucked by the transfer pump 10, so that the chemicals near the plating surface can be usually changed with new one and metallic ions also be supplied enough to a negative electrode surface for all times. Hydrogen air bubbles producing during plating are immediately and forcibly transferred to the outside of the sparger 2 through suction of the chemicals. COPYRIGHT: (C)2006,JPO&NCIPI
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