| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for semiconductor encapsulation, expectable to shorten the encapsulation time in FC mounting and set a high silica content by using spherical silica powder particles having high fluidity and provide a semiconductor device having extremely high reliability by using the encapsulation material. SOLUTION: The liquid epoxy resin composition for semiconductor encapsulation contains (a) a liquid epoxy resin, (b) an inorganic filler, (c) a hardener and (d) a cure accelerator. The inorganic filler is spherical silica powder particles having high fluidity, containing≤5,000 ppm of particles having particle diameter of≥10μm, and having an average particle diameter of 1-5μm and a ratio of particles of≤0.2μm diameter of 0.2-20 mass%. The content of the silica powder particles in the epoxy resin composition is 60-85 mass%. COPYRIGHT: (C)2006,JPO&NCIPI
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