发明名称 |
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
摘要 |
A method of fabricating a semiconductor device that includes a disordered portion, the method comprising depositing a disordering-enhancing film (8) on a portion corresponding to a window structure (14) area, depositing a protective film (9) at least on portions other than the window structure (14) portion by a catalytic CVD method, and disordering the window structure (14) by a thermal treatment. Accordingly, a semiconductor device such as a semiconductor laser device in which only a portion to be partially disordered such as a portion to be a window structure is disordered, with no adverse effect on the other potions not to be disordered. The semiconductor device fabricated using this method shows high output power, long lifetime, and high reliability.
|
申请公布号 |
EP1617533(A1) |
申请公布日期 |
2006.01.18 |
申请号 |
EP20040728254 |
申请日期 |
2004.04.19 |
申请人 |
FURUKAWA ELECTRIC CO., LTD.;MITSUI CHEMICALS, INC. |
发明人 |
YAMADA, YUMI;IZUMI, AKIRA |
分类号 |
H01L21/324;H01L21/26;H01S5/028;H01S5/16;(IPC1-7):H01S5/16 |
主分类号 |
H01L21/324 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|