| 摘要 |
Memory module comprises several memory chips (1,1') mounted on a substrate (2). The back of the upper chip faces the front of the lower chip and the chips are separated by layers of insulator. Bond pads are attached to their ends, from which parallel leads (3,3') emerge. One of the insulating layers (4) is solid, while the others (6) are applied as a liquid which is then cured, embedding the ends of the leads. An independent claim is included for a method for making the module by bonding chips to the substrate, applying the liquid insulator, embedding the solid insulator in it and curing it, after which additional chips are glued to the insulating layers. |
