发明名称 |
LAYERED MICROELECTRONIC CONTACT AND METHOD FOR FABRICATING SAME |
摘要 |
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate. |
申请公布号 |
EP1616353(A2) |
申请公布日期 |
2006.01.18 |
申请号 |
EP20040759413 |
申请日期 |
2004.04.12 |
申请人 |
FORMFACTOR, INC. |
发明人 |
KHANDROS, IGOR, K.;MILLER, CHARLES, A.;WENZEL, STUART, W. |
分类号 |
H01L23/48;H01L23/485;H01R43/00;H05K3/32;H05K3/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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