发明名称 |
Fluidic MEMS device |
摘要 |
<p>A MEMS package 1 comprises a substrate 3 and a cove plate 2. A MEMS structure 32 is fabricated on a surface 31 of the substrate. The cover plate 2 may be bonded to the substrate 3 by a bond ring 4. The cover plate 2, the bond ring 4 and the substrate 3 may define an inner cavity 11. The cover plate 2, the substrate 3 and a breach 42 in the bond ring 4 may define a fill port 111.
</p> |
申请公布号 |
EP1498385(A3) |
申请公布日期 |
2006.01.18 |
申请号 |
EP20040003147 |
申请日期 |
2004.02.12 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
SMITH, MARK A.;BOUCHER, WILLIAM R.;HALUZAK, CHARLES C. |
分类号 |
B81B7/00;B81B7/02;B81C1/00;B81C3/00;G02B26/08;H01L23/24 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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