| 摘要 |
In the planarization apparatus (10), an etching stage (22) is installed in a body (12) where a rough grinding stage (18) and a finishing grinding stage (20) are disposed, and the rough grinding, finishing grinding, and etching of a wafer (28) are performed in the same planarization apparatus (10). A chuck (32, 36, 38, 40) for holding the wafer (28) is moved in an order through the rough grinding stage (18), the finishing grinding stage (20) and the etching stage (22) while keeping holding the wafer (28). When the chuck (32, 36, 38, 40) is positioned at the etching stage (22), the chuck (32, 36, 38, 40) is moved up toward an etching vessel (25) and the wafer (28) that is held by the chuck (32, 36, 38, 40) is housed in the etching vessel (25). In this state, etching solution (92) is projected on the wafer (28) from a nozzle (94) and the wafer (28) is etched. |
