发明名称 |
HELICAL MICROELECTRONIC CONTACT AND METHOD FOR FABRICATING SAME |
摘要 |
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact. |
申请公布号 |
EP1616352(A1) |
申请公布日期 |
2006.01.18 |
申请号 |
EP20040759412 |
申请日期 |
2004.04.12 |
申请人 |
FORMFACTOR, INC. |
发明人 |
LINDSEY, SCOTT, E.;MILLER, CHARLES, A.;ROYSTER, DAVID, M.;WENZEL, STUART, W. |
分类号 |
G01R1/067;G01R31/28;H01L21/48;H01L23/498;H01R4/48;H01R13/03;H01R13/24;H01R13/33;H01R43/16;H05K3/32;H05K3/40 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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