发明名称 RESIN FOR UNDER-LAYER MATERIAL, UNDER-LAYER MATERIAL, LAMINATE AND METHOD FOR FORMING RESIST PATTERN
摘要 <p>A resin for an undercoating material for forming an underlying film between a substrate and a photoresist layer, wherein the resin is a novolac resin containing 1% by mass or less, as measured by gel permeation chromatography, of low molecular weight components having a molecular weight of 500 or less. An undercoating material containing the resin, a laminate containing the undercoating material, and a resist pattern forming method using the undercoating material.</p>
申请公布号 EP1616888(A1) 申请公布日期 2006.01.18
申请号 EP20040727426 申请日期 2004.04.14
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 NAKAMURA, TSUYOSHI
分类号 H01L21/027;C08G8/04;C08G8/08;C08G8/12;G03F7/00;G03F7/022;G03F7/023;G03F7/075;G03F7/09;G03F7/095;G03F7/26;G03F7/11;(IPC1-7):C08G8/04 主分类号 H01L21/027
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