发明名称 |
RESIN FOR UNDER-LAYER MATERIAL, UNDER-LAYER MATERIAL, LAMINATE AND METHOD FOR FORMING RESIST PATTERN |
摘要 |
<p>A resin for an undercoating material for forming an underlying film between a substrate and a photoresist layer, wherein the resin is a novolac resin containing 1% by mass or less, as measured by gel permeation chromatography, of low molecular weight components having a molecular weight of 500 or less. An undercoating material containing the resin, a laminate containing the undercoating material, and a resist pattern forming method using the undercoating material.</p> |
申请公布号 |
EP1616888(A1) |
申请公布日期 |
2006.01.18 |
申请号 |
EP20040727426 |
申请日期 |
2004.04.14 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NAKAMURA, TSUYOSHI |
分类号 |
H01L21/027;C08G8/04;C08G8/08;C08G8/12;G03F7/00;G03F7/022;G03F7/023;G03F7/075;G03F7/09;G03F7/095;G03F7/26;G03F7/11;(IPC1-7):C08G8/04 |
主分类号 |
H01L21/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|