A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.
申请公布号
KR20060005867(A)
申请公布日期
2006.01.18
申请号
KR20040054855
申请日期
2004.07.14
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KANG, SUK CHAE;LEE, SI HOON;KANG, SA YOON;KIM, DONG HAN;IM, YUN HYEOK;KIM, GU SUNG