SOLID-STATE IMAGING DEVICE

摘要

A solid-state imaging device (IS1) comprising a package (P1), a CCD chip (11) and a chip resistance array (21). A mounting unit (2) for mounting the CCD chip (11) and the chip resistance array (21) thereon is provided to the package (P1) so as to protrude into a hollow (1). The mounting unit (2) has a first plane unit (3) and a second plane unit (4) that are formed with a step difference. The CCD chip (11) is placed on the first plane unit (3) via a spacer (13) and fixed. The chip resistance array (21) is placed on the second plane unit (4) and fixed. The chip resistance array (21) is disposed so as to be closed to the CCD chip (11) by using the step difference between the first plane unit (3) and the second plane unit (4).