发明名称 Polishing pad and method of producing the same
摘要 A polishing pad has a working layer provided with an abrasive powder, an attaching layer for attaching a pad to a polishing head of a power tool, and a connection layer which connects the working layer with the attaching layer, the connection layer being located between the working and the attaching layer and having a peripheral region which is thinner and also a central region which is thicker than the peripheral region and therefore has an increased elasticity so that during polishing an elasticity of a central portion of the working layer is increased.
申请公布号 US6986706(B1) 申请公布日期 2006.01.17
申请号 US20040916379 申请日期 2004.08.10
申请人 UNIVERSAL PHOTONICS, INC. 发明人 COOPER ALEX;BEDERAK YEVGENY
分类号 B24D11/00;B24D99/00 主分类号 B24D11/00
代理机构 代理人
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