发明名称 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
摘要 A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
申请公布号 US6986382(B2) 申请公布日期 2006.01.17
申请号 US20030439912 申请日期 2003.05.16
申请人 COOLIGY INC. 发明人 UPADHYA GIRISH;KENNY THOMAS W.;ZHOU PENG;MUNCH MARK;SHOOK JAMES GILL;GOODSON KENNETH;CORBIN DAVID
分类号 F28F7/00;F04B19/00;F28D15/02;F28F3/12;H01L23/473 主分类号 F28F7/00
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