发明名称 Method for mounting parts
摘要 A method for mounting parts may include recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking up a part on the part feeder, moving an image sensor installed to be capable of moving to a position close to the particular part feeder, picking up a part from the particular part feeder with a suction nozzle installed at the had unit, moving the head unit to a position above the image sensor, detecting an image of the part held by the suction nozzle, moving the suction nozzle to a printed circuit board from the image sensor, and aligning the part with the printed circuit board while determining and compensating for an error generated when the part is picked up, and mounting the aligned part on the printed circuit board.
申请公布号 US6986200(B2) 申请公布日期 2006.01.17
申请号 US20020305232 申请日期 2002.11.27
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 HWANG YOUNG-SOO;CHO TAE-YEON;SHIN JHIN-WOO
分类号 H05K3/30;H05K13/04 主分类号 H05K3/30
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