| 摘要 |
A crisp, approximately circular wafer product is provided whereby the two surfaces of the wafer each has a pattern formed by ridges, the first surface having a pattern comprising at least two grid patterns superimposed on each other, one grid being at an angle of approximately 45.degree. to the other, the second surface having a single grid pattern, the pattern being at 45.degree. to the lower grid on the first surface. |
