发明名称 |
Methods and apparatus for improving high frequency input/output performance |
摘要 |
An impedance matching circuit is provided for an IC arranged on a package that matches an impedance of an external load. The circuit includes a package, an IC that is arranged on the package, and an impedance matching circuit. The impedance matching circuit includes a first bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with said IC, a capacitance element arranged on the IC, and a second bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with one end of said capacitance element.
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申请公布号 |
US6987326(B1) |
申请公布日期 |
2006.01.17 |
申请号 |
US20050033202 |
申请日期 |
2005.01.11 |
申请人 |
MARVELL INTERNATIONAL LTD. |
发明人 |
JIN XIAODONG;TSE LAWRENCE;TSAI KING CHUN;CHIEN GEORGE;WEI SHURAN |
分类号 |
H01L23/49;H01L23/48;H01L23/60;H01L23/66 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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