发明名称 |
Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials |
摘要 |
A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
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申请公布号 |
US6986199(B2) |
申请公布日期 |
2006.01.17 |
申请号 |
US20040868448 |
申请日期 |
2004.06.09 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY |
发明人 |
ARNOLD CRAIG B.;PIQUE ALBERTO;AUYEUNG RAY;NURNBERGER MICHAEL |
分类号 |
H01R43/00;H05K1/16;H05K1/18;H05K3/00;H05K5/06 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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