VERFAHREN ZUM EINBETTEN EINES IC-BAUSTEINS IN EINER GESCHÄUMTEN SCHICHT EINER CHIPKARTE

摘要

The invention relates to a method for producing monolayer and multilayer chip cards (1) and to a method for producing a semi-finished product for chip cards and to a corresponding semi-finished product. Cavities (21) are embossed into a foamed plastic material (20). The electronic components (30) of the chip cards are inserted into said cavities. The pre-embossed, foamed plastic material (20) may be used as a monolayer chip or, if provided with the electronic components, as a card inlet for a monolayer card or a laminate card. The production of cavities for the electronic components by deep-embossing foamed plastic material is inexpensive and subjects the electronic components to a minimum of mechanical stress. The embossing method facilitates the production of cavities having complex geometrical shapes.