| 摘要 |
PROBLEM TO BE SOLVED: To prevent surface-mounting electronic components from being soldered due to pulling and hence dislocating them in some connecting direction of a pattern by the solder tension when the solder melts in connecting pads to the pattern on a printed circuit board. SOLUTION: A pattern 1 is connected to pads 4 in a predetermined direction only so that surface-mounting electronic components 2 are mutually pulled due to the tension of solder at melting to prevent the surface-mounting electronic components 2 from being dislocated, using the tension of the solder at melting, thus improving the soldering reliability. COPYRIGHT: (C)2006,JPO&NCIPI
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