Verfahren und Vorrichtung für Nickelplattierung

摘要

According to the present invention, Ni-B (62) is electrolessly deposited on an object (19) and then Ni-P (63) is electrolessly deposited on the surface of the Ni-B layer formed on the object. In this process, if any dry area is present on the Ni-B layer where moisture has been evaporated after the Ni-B depositing step and before the Ni-P depositing step, it is difficult to form a uniform Ni-P layer on the Ni-B layer in such area. Accordingly, an additional step is provided for preventing the Ni-B layer formed on the object from drying after the Ni-B plating step and before the Ni-P plating step. In this way, a uniform Ni-P layer can be electrolessly deposited on the electrolessly deposited Ni-B layer.