发明名称 MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATION DEVICE, AND PIEZOELECTRIC VIBRATION DEVICE OBTAINED BY THE MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric vibration device for adopting second sealing under a vacuum atmosphere whereby no molten gas of a sealing member is resident in a package and no dispersion takes place in product characteristics. <P>SOLUTION: In the manufacturing method of the piezoelectric vibration device wherein a circumferential part of an opening of a package 1 and a lid 2 for covering the opening are welded via a sealing member 2b under a vacuum atmosphere in a welding step, which comprises: a primary sealing step of welding the lid 2 to the circumferential part while leaving a residual opening at part of the circumferential part of the opening; an exhaust step by vacuuming; and thereafter a secondary sealing step of welding the lid to the opening residual part having not been welded, the primary sealing being carried out under a sealing condition defined by formula of 7.33≤a/b≤10.4, wherein a is an area of the opening and b is a size of the opening residual part. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006013710(A) 申请公布日期 2006.01.12
申请号 JP20040185357 申请日期 2004.06.23
申请人 DAISHINKU CORP 发明人 KANETANI MICHIYOSHI
分类号 H03H3/02;H01L23/02;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H03H9/02 主分类号 H03H3/02
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