| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a thin sheet which has a compact size and with which a high quality silicon wafer can be obtained. SOLUTION: The apparatus 30 for manufacturing the thin sheet is provided with a first and a second chambers 32a, 32b that can be communicated/shut-off through a first opening/closing door 37, two crucibles 31a, 31b that are housed within the first or the second chamber and have melt of silicon therein, a crucible-transferring means 36 that can freely transfer the crucibles between the first and the second chambers, and a dipping means 35 that can dip a ground substrate 33 into the melt in the crucibles. The dipping means can dip the ground substrate into one of crucibles selected from the two crucibles that are arranged in parallel within the first chamber by the crucible-transferring means, and can grow by solidification of a polycrystalline silicon wafer on the surface for crystalline growth of the ground substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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