| 摘要 |
Lacquer formulations containing: from 5 to 99.5 wt. % of solids of a polymer component or of a mixture of two or more physically or chemically crosslinking polymer components, (binder components and hardener components), from 0 to 80 wt. % of a low molecular weight component acting as solvent or of a mixture of such low molecular weight components, from 0.5 to 50 wt. % of a silanised, structurally modified pyrogenic silica to the surface of which there are attached alkylsilyl groups (SiC<SUB>n</SUB>H<SUB>2n+1</SUB>, where n=from 2 to 18) and/or dimethylsilyl groups and/or monomethylsilyl groups, from 0 to 10 wt. % of commercially available additives.
|
