发明名称 LASER MACHINING METHOD AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To realize the splitting of a hardly machinable material and the marking of the interior of a transparent object to be machined. <P>SOLUTION: This laser machining device comprises a laser generator 1, condensing point setting means 21 and 43 which set a condensing point at a specified position, in the thickness direction, of the interior of the lat plate-like object 3 to be machined by condensing/entering a laser light from a surface A 31 of the object 3 having two surfaces A/B 31 and 32 positioned back-to-back and condensing point transfer means 41 and 42 which transfer the condensing point set by the condensing point setting means 21 and 43 in parallel with the surface A 31. In addition, the laser machining means splits the object 3 by forming a modification region due to the multiple photon absorption of the laser light in a transfer trajectory of the condensing point by the condensing point transfer means 41 and 42. The object 3 is split by sequentially setting the specified position in the thickness direction, in the surface A 31 direction from a position near a surface B 32 opposite to the surface A 31 by the condensing point setting means 41 and 42, and the interior of the object 3 is marked. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006007619(A) 申请公布日期 2006.01.12
申请号 JP20040188870 申请日期 2004.06.25
申请人 AISIN SEIKI CO LTD 发明人 SASAKI RYUICHIRO
分类号 B28D5/00;B23K26/00;B23K26/06;C03B33/09;H01L21/301 主分类号 B28D5/00
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