发明名称 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To exactly detect a short circuit between wiring patterns on a substrate to be inspected, having a plurality of wiring patterns formed in parallel and in line, and a dummy electrode formed to be conductible with the base end of the wiring patterns. SOLUTION: In the case that wiring patterns PTK and PTM are not shorted, no voltage is generated between probes 11C and 11D and so a voltage detected with a voltage meter VM is zero. In the case that the wiring patterns PTK and PTM are shorted at a position of distances L4, L5 from the base ends PTKb, PTMb, the detection voltage V3 with the voltage meter VM is expressed as V3≈I2×r1×L4 using a resistance r1 per unit length of the wiring pattern PTK and a curret I2 supplied with a constant current source AG. Thus, by setting a threshold to lower value than the voltage V3, occurrence of short can be detected in the case that the wiring pattern PTK and PTM are short at the position of distances L4 and L5 from the base ends PTKb and PTMb. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006010496(A) 申请公布日期 2006.01.12
申请号 JP20040187866 申请日期 2004.06.25
申请人 NIDEC-READ CORP 发明人 NAGATA YUKINOBU
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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