| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method capable of washing away a plating solution stuck to the back face of a wafer immediately after plating treatment by a simple structure in a mass-production line including a face up type plating apparatus. SOLUTION: In the mass-production line including a face up type plating apparatus 3, a nozzle 21 for cleaning the back face of a wafer is arranged below a moving space in a robot 2 for taking out a wafer from the upper face of a wafer holder 4 at the lower part of the plating apparatus 3. COPYRIGHT: (C)2006,JPO&NCIPI
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