发明名称 Trenched semiconductor devices and their manufacture
摘要 In semiconductor devices which include an insulated trench electrode ( 11 ) in a trench ( 20 ), for example, trench-gate field effect power transistors and trenched Schottky diodes, a cavity ( 23 ) is provided between the bottom ( 25 ) of the trench electrode ( 11 ) and the bottom ( 27 ) of the trench ( 20 ) to reduce the dielectric coupling between the trench electrode ( 11 ) and the body portion at the bottom ( 27 ) of the trench in a compact manner. In power transistors, the reduction in dielectric coupling reduces switching power losses, and in Schottky diodes, it enables the trench width to be reduced.
申请公布号 US2006008991(A1) 申请公布日期 2006.01.12
申请号 US20050220297 申请日期 2005.09.02
申请人 HIJZEN ERWIN A;IN TZANDT MICHAEL A;HUETING RAYMOND J 发明人 HIJZEN ERWIN A.;IN'TZANDT MICHAEL A.;HUETING RAYMOND J.
分类号 H01L21/336;H01L29/41;H01L21/28;H01L29/423;H01L29/47;H01L29/49;H01L29/51;H01L29/78;H01L29/872 主分类号 H01L21/336
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