TREATING DEVICE AND HEATER UNIT

摘要

A treating device and a heater unit. The treating device comprises a loading table formed so that cracking does not occur therein due to the heating of heaters buried therein. The loading table (32A) for placing a wafer (W) thereon further comprises a plurality of areas (32Aa) and (32Ab), and one of the plurality of heaters is buried in each of the plurality of areas independently of each other. The heater (35Aa) buried in one area (32Aa) of the areas adjacent to each other comprises a portion (35Aa<sub